Low Thermal Impedance Conductive Silicon Gap Filler GPU CPU Heatsink Cooling

Product Categories

Phase Changing Materials [40]
Thermal Conductive Pad [164]
Thermal Gap Filler [196]
Thermal Conductive Grease [27]
Thermal Insulation Materials [48]
Thermal Graphite Sheet [56]
Thermal Adhesive Tape [47]
Thermal Conductive Glue [15]
Thermal Conductive Adhesive [13]
Thermal Conductive Plastic [23]
Sponge Foam Material [13]
PET Double Sided Tape [11]
Thermal Gap Pad [406]
Thermal Conductive Gel [22]
Silicone Foam Gasket [11]
Silicone Free Gap Filler Pad [13]
Shielding Absorbing Materials [19]
Thermal Conductivity Sharp Metal [2]

Dongguan Ziitek Electronic Materials & Technology Ltd.

Trust Seal

Verified Supplier

Credit Check

Supplier Assessment

Contact Now

Dongguan Ziitek Electronic Materials & Technology Ltd.

Visit Website

City: Dongguan

Province/State: Guangdong

Country/Region: China

View Contact Details

Low Thermal Impedance Conductive Silicon Gap Filler GPU CPU Heatsink Cooling

Contact Now

Low Thermal Impedance Conductive Silicon Gap Filler GPU CPU Heatsink Cooling

Low thermal impedance conductive silicon gap filler GPU CPU heatsink cooling thermal interface pad Ziitek TIF7100HP use a special process, with silicone as the base material, adding thermal conductive ...

Product Tags:

GPU heatsink cooling thermal interface pad

CPU heatsink cooling thermal interface pad

Conductive Silicon Thermal Interface Pad

Send your message to this supplier


*From:	Your email address is incorrect!
*To:	Dongguan Ziitek Electronic Materials & Technology Ltd.
*Subject:	Subject is empty!
*Message:	For the best results, we recommend including the following details: -Self introduction -Required specifications -Inquire about price/MOQ Characters Remaining: (0/3000) Please enter 20 to 3000 characters to contact this supplier!