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3.0 W/M-K Thermally Conductive Gap Filler Pads Rohs Compliant For Cd Rom

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3.0 W/M-K Thermally Conductive Gap Filler Pads Rohs Compliant For Cd Rom

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Brand Name : ZIITEK

Model Number : TIF1120-30-06UF

Certification : UL and RoHs

Place of Origin : China

MOQ : 1000pcs

Price : negotiation

Supply Ability : 100000pcs/day

Delivery Time : 3-5 work days

Packaging Details : 1000pcs/bag

Feature : Outstanding thermal performance

name : 3.0 W/m-K Conductive Pads RoHS Compliant For CD-Rom

keyword : thermal gap pad

Thickness : 3.0mmT

Continuos Use Temp : -40 to 160℃

color : White

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3.0 W/m-K Conductive Pads RoHS Compliant For CD-Rom​

The TIF1120-30-06UF is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.

TIF100-30-06UF-Series-Datasheet-.pdf

Features

> Good thermal conductive: 3.0 W/mK

>Thickness: 3.0mmT

>hardness:75±5 shore 00

>Colour: White

>RoHS compliant
>UL recognized
>Fiberglass reinforced for puncture, shear and tear resistance

Applications

>Automotive electronics

>Set top boxes

>Audio and video components

>IT infrastructure

>GPS navigation and other portable devices

>CD-Rom, DVD-Rom cooling

Typical Properties of TIF1120-30-06UF Series
Color
White
Visual
Composite Thickness
Thermal Impedance@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone elastomer
***
10mils / 0.254 mm
0.16
20mils / 0.508 mm
0.20

Specific gravity
3.0 g/cc
ASTM D297
30mils / 0.762 mm
0.31
40mils / 1.016 mm
0.36
Thickness
3.0mmT
***
50mils / 1.270 mm
0.42
60mils / 1.524 mm
0.48
Hardness

75±5 Shore 00
ASTM 2240
70mils / 1.778 mm
0.53
80mils / 2.032 mm
0.63
Outgasing (TML)
0.32%
ASTM E595
90mils / 2.286 mm
0.73
100mils / 2.540 mm
0.81
Continuos Use Temp
-40 to 160℃
***
110mils / 2.794 mm
0.86
120mils / 3.048 mm
0.93
Dielectric Breakdown Voltage
>5500 VAC
ASTM D149
130mils / 3.302mm
1.00
140mils /3.556 mm
1.08
Dielectric Constant

5.0 MHz
ASTM D150
150mils / 3.810 mm
1.13
160mils / 4.064 mm
1.20
Volume Resistivity
2.3X1013
Ohm-cm
ASTM D257
170mils / 4.318 mm
1.24
180mils / 4.572 mm
1.32
Fire rating
94 V0
equivalent
UL
190mils / 4.826 mm
1.41
200mils / 5.080 mm
1.52
Thermal conductivity
3.0 W/m-K
ASTM D5470
Visua l/ ASTM D751
ASTM D5470

Company Profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

3.0 W/M-K Thermally Conductive Gap Filler Pads Rohs Compliant For Cd Rom

FAQ:

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge.


Product Tags:

3.0 w/m-k thermally conductive gap filler pads

      

rohs thermally conductive gap filler pads

      

cd rom thermal interface pad

      
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