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3.0w/Mk Thermal Gap Pad For Telecommunication Hardware

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Dongguan Ziitek Electronic Materials & Technology Ltd.

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3.0w/Mk Thermal Gap Pad For Telecommunication Hardware

Name: 30wMk Thermal Gap Pad For Telecommunication Hardware
Brand: ZIITEK
Price: 1 USD

Wholesale 3.0w/Mk Thermal Gap Pad For Telecommunication Hardware from china suppliers

Brand Name : ZIITEK

Model Number : TIF120-30-02US

Certification : UL and RoHs

Place of Origin : China

MOQ : 1000pcs

Price : negotiation

Supply Ability : 100000pcs/day

Delivery Time : 3-5 work days

Packaging Details : 1000pcs/bag

Specific gravity : 2.9 g/cc

hermal conductive : 3.0W/mk

Thickness : 0.5mmT

keyword : thermal gap pad

name : 3.0W/mk Light Gray Outstanding Thermal Performance Thermal Pad for Telecommunication Hardware

Hardness : 20 Shore 00

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3.0W/mk Light Gray Outstanding Thermal Performance Thermal Pad for Telecommunication Hardware

The TIF120-30-02US thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -40℃~160℃ and meet the requirement of UL94V0.

TIF100-30-02US-Datasheet-REV02.pdf

Features

> Good thermal conductive: 3.0 W/mK

>Thickness:0.5mmT

>hardness:20 shore 00

>Colour: gray

>RoHS compliant

>UL recognized

>Fiberglass reinforced for puncture, shear and tear resistance

Applications

>Automotive engine control units

>Telecommunication hardware

>Handheld portable electronics

>Semiconductor automated test equipment (ATE)

>CPU

>display card

Typical Properties of TIF120-30-02US Series
Color	Gray	Visual	Composite Thickness	Thermal Impedance@10psi (℃-in²/W)
Construction & Compostion	Ceramic filled silicone elastomer	***	10mils / 0.254 mm	0.16
			20mils / 0.508 mm	0.20
Specific gravity	2.9 g/cc	ASTM D297	30mils / 0.762 mm	0.31
			40mils / 1.016 mm	0.36
Thickness	0.5mmT	***	50mils / 1.270 mm	0.42
			60mils / 1.524 mm	0.48
Hardness	20 Shore 00	ASTM 2240	70mils / 1.778 mm	0.53
			80mils / 2.032 mm	0.63
Outgasing (TML)	0.35%	ASTM E595	90mils / 2.286 mm	0.73
			100mils / 2.540 mm	0.81
Continuos Use Temp	-40 to 160℃	***	110mils / 2.794 mm	0.86
			120mils / 3.048 mm	0.93
Dielectric Breakdown Voltage	>5500 VAC	ASTM D149	130mils / 3.302mm	1.00
			140mils /3.556 mm	1.08
Dielectric Constant	3.8 MHz	ASTM D150	150mils / 3.810 mm	1.13
			160mils / 4.064 mm	1.20
Volume Resistivity	1.0X10¹² Ohm-cm	ASTM D257	170mils / 4.318 mm	1.24
			180mils / 4.572 mm	1.32
Fire rating	94 V0	equivalent UL	190mils / 4.826 mm	1.41
			200mils / 5.080 mm	1.52
Thermal conductivity	3.0 W/m-K	ASTM D5470	Visua l/ ASTM D751	ASTM D5470

Company Profile

With professional R&D capabilities and over 13 year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.

Standard Sheets Sizes:

8" x 16"(203mm x 406mm)

TIF™ series Individual die cut shapes can be supplied.

3.0w/Mk Thermal Gap Pad For Telecommunication Hardware

FAQ:

Q: Do you offer free samples ?

A: Yes, we are willing to offer free sample.

Q: What is your terms of payment ?

A: Payment<=2000USD, T/T in advance. Paying in time and faithful for several months, we can apply other payment term for you, pay together in every month or 30 days.

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3.0w/Mk Thermal Gap Pad For Telecommunication Hardware

3.0w/Mk Thermal Gap Pad For Telecommunication Hardware

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