Home > Thermal Gap Pad >

3.2 W/Mk Thermal Gap Pad High Tack Surface Reduces Contact Resistance For Notebook

Product Categories

Phase Changing Materials [38]
Thermal Conductive Pad [155]
Thermal Gap Filler [189]
Thermal Conductive Grease [27]
Thermal Insulation Materials [46]
Thermal Graphite Sheet [53]
Thermal Adhesive Tape [47]
Thermal Conductive Glue [15]
Thermal Conductive Adhesive [13]
Thermal Conductive Plastic [23]
Sponge Foam Material [13]
PET Double Sided Tape [11]
Thermal Gap Pad [406]
Thermal Conductive Gel [22]
Silicone Foam Gasket [11]
Silicone Free Gap Filler Pad [13]
Shielding Absorbing Materials [19]
Thermal Conductivity Sharp Metal [2]

Dongguan Ziitek Electronic Materials & Technology Ltd.

Trust Seal

Verified Supplier

Credit Check

Supplier Assessment

Contact Now

3.2 W/Mk Thermal Gap Pad High Tack Surface Reduces Contact Resistance For Notebook

Name: 32 WMk Thermal Gap Pad High Tack Surface Reduces Contact Resistance For Notebook
Brand: ZIITEK
Price: 1 USD

Wholesale 3.2 W/Mk Thermal Gap Pad High Tack Surface Reduces Contact Resistance For Notebook from china suppliers

Brand Name : ZIITEK

Model Number : TIF1140-32-05US

Certification : UL and RoHs

Place of Origin : China

MOQ : 1000pcs

Price : negotiation

Supply Ability : 100000pcs/day

Delivery Time : 3-5 work days

Packaging Details : 1000pcs/bag

Application : notebook

keyword : thermal gap pad

name : 3.2 W/mK High Tack Surface Reduces Contact Resistance Thermal pad for Notebook

thermal conductive : 3.2 W/mK

Feature : Outstanding thermal performance

Specific gravity : 3.0g/cc

Contact Now

3.2 W/mK High Tack Surface Reduces Contact Resistance Thermal pad for Notebook

The TIF1140-32-05US use a special process, with silicone as the base material, adding thermal conductive powder and flame retardant together to make the mixture to become thermal interface material. This is effective in lower the thermal resistance between the heat source and the heat sink.

TIF100-32-05US-Series-Datasheet-REV02.pdf

Features

> Good thermal conductive: 3.2 W/mK

>Thickness:3.5mmT

>hardness:20 shore 00

>Colour: blue

>Moldability for complex parts

>Outstanding thermal performance

>High tack surface reduces contact resistance

Applications

>mainboard/mother board

>notebook

>power supply

>Heat pipe thermal solutions

>Memory Modules

>Mass storage devices

Typical Properties of TIF1140-32-05US Series
Color	blue	Visual	Composite Thickness	Thermal Impedance@10psi (℃-in²/W)
Construction & Compostion	Ceramic filled silicone elastomer	***	10mils / 0.254 mm	0.16
			20mils / 0.508 mm	0.20
Specific gravity	3.0g/cc	ASTM D297	30mils / 0.762 mm	0.31
			40mils / 1.016 mm	0.36
Thickness	3.5mmT	***	50mils / 1.270 mm	0.42
			60mils / 1.524 mm	0.48
Hardness	20 Shore 00	ASTM 2240	70mils / 1.778 mm	0.53
			80mils / 2.032 mm	0.63
Outgasing (TML)	0.35%	ASTM E595	90mils / 2.286 mm	0.73
			100mils / 2.540 mm	0.81
Continuos Use Temp	-40 to 160℃	***	110mils / 2.794 mm	0.86
			120mils / 3.048 mm	0.93
Dielectric Breakdown Voltage	>5500 VAC	ASTM D149	130mils / 3.302mm	1.00
			140mils /3.556 mm	1.08
Dielectric Constant	4.0 MHz	ASTM D150	150mils / 3.810 mm	1.13
			160mils / 4.064 mm	1.20
Volume Resistivity	1.0X10¹² Ohm-cm	ASTM D257	170mils / 4.318 mm	1.24
			180mils / 4.572 mm	1.32
Fire rating	94 V0	equivalent UL	190mils / 4.826 mm	1.41
			200mils / 5.080 mm	1.52
Thermal conductivity	3.2 W/m-K	ASTM D5470	Visua l/ ASTM D751	ASTM D5470

Company Profile

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

3.2 W/Mk Thermal Gap Pad High Tack Surface Reduces Contact Resistance For Notebook

FAQ:

Q: How do I request customized samples?

A: To request samples, you can leave us message on website, or just contact us by send email or call us.

Q: What's the thermal conductivity test method given on the data sheet ?

A: All the data in the sheet are actual tested.Hot Disk and ASTM D5470 are utilized to test the thermal conductivity.

Product Tags:

3.2 W/Mk Thermal Gap Pad High Tack Surface Reduces Contact Resistance For Notebook Images

Inquiry Cart 0

Send your message to this supplier


*From:	Your email address is incorrect!
*To:	Dongguan Ziitek Electronic Materials & Technology Ltd.
*Subject:	Subject is empty!
*Message:	For the best results, we recommend including the following details: -Self introduction -Required specifications -Inquire about price/MOQ Characters Remaining: (0/3000) Please enter 20 to 3000 characters to contact this supplier!

3.2 W/Mk Thermal Gap Pad High Tack Surface Reduces Contact Resistance For Notebook

3.2 W/Mk Thermal Gap Pad High Tack Surface Reduces Contact Resistance For Notebook

3.2 w/mk thermal gap pad

notebook thermal gap pad

3.2 w/mk gap pad

3.2 W/Mk Thermal Gap Pad High Tack Surface Reduces Contact Resistance For Notebook Images