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5.0W/Mk Good Thermal Conductive Heat Sink Pad For Memory Modules

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5.0W/Mk Good Thermal Conductive Heat Sink Pad For Memory Modules

Name: 50WMk Good Thermal Conductive Heat Sink Pad For Memory Modules
Brand: ZIITEK
Price: 1 USD

Wholesale 5.0W/Mk Good Thermal Conductive Heat Sink Pad For Memory Modules from china suppliers

Brand Name : ZIITEK

Model Number : TIF160N-50-10F thermal pad

Certification : UL and RoHs

Place of Origin : China

MOQ : 1000pcs

Price : negotiation

Supply Ability : 100000pcs/day

Delivery Time : 3-5 work days

Packaging Details : 1000pcs/bag

keyword : Thermal Gap Pad

Continuos Use Temp : -40 to 160℃

hardness : 55±5 shore 00

name : 5.0W/mk Good Thermal Conductive Heat Sink Pad for Memory Modules

part number : TIF160N-50-10F

Certifications : IECQ QC 080000

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5.0W/mk Good Thermal Conductive Heat Sink Pad for Memory Modules

The TIF160N-50-10F is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling.

TIF100N-40-10F-Specification-sheet.pdf

Features

> Good thermal conductive: 5.0 W/mK

>Thickness: 1.5mmT

>hardness:55±5 shore 00

>Colour: Gray

>Good thermal conductive
>Moldability for complex parts
>Soft and compressible for low stress applications

Applications

>mainboard/mother boar

>notebook

>power supply

>Heat pipe thermal solutions

>Memory Modules

>Mass storage devices

Typical Properties of TIF160N-50-10F Series
Color	Gray	Visual	Composite Thickness	Thermal Impedance@10psi (℃-in²/W)
Construction & Compostion	Ceramic filled silicone elastomer	***	10mils / 0.254 mm	0.16
			20mils / 0.508 mm	0.20
Specific gravity	2.1 g/cm³	ASTM D297	30mils / 0.762 mm	0.31
			40mils / 1.016 mm	0.36
Thickness	1.5mmT	***	50mils / 1.270 mm	0.42
			60mils / 1.524 mm	0.48
Hardness	55±5 Shore 00	ASTM 2240	70mils / 1.778 mm	0.53
			80mils / 2.032 mm	0.63
Thermal conductivity	5.0W/mk	ISO22007-2.2	90mils / 2.286 mm	0.73
			100mils / 2.540 mm	0.81
Continuos Use Temp	-40 to 160℃	***	110mils / 2.794 mm	0.86
			120mils / 3.048 mm	0.93
Dielectric Breakdown Voltage	>5500 VAC	ASTM D149	130mils / 3.302mm	1.00
			140mils /3.556 mm	1.08
Dielectric Constant	4.7 MHz	ASTM D150	150mils / 3.810 mm	1.13
			160mils / 4.064 mm	1.20
Volume Resistivity	1.0X10¹² Ohm-cm	ASTM D257	170mils / 4.318 mm	1.24
			180mils / 4.572 mm	1.32
Fire rating	94 V0	equivalent UL	190mils / 4.826 mm	1.41
			200mils / 5.080 mm	1.52
Thermal conductivity	5.0 W/m-K	ASTM D5470	Visua l/ ASTM D751	ASTM D5470

Company Profile

Ziitek Electronic Material and Technology Ltd. provides product solutions to equipment product which generates too much heat affecting its high performance when using. Plus thermal products can control and manage heat to keep it cool to some extent.

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

5.0W/Mk Good Thermal Conductive Heat Sink Pad For Memory Modules

FAQ:

Q: Do you accept custom orders ?

A:Yes , welcome to custom orders. Our custom elements including dimension , shape , color and coated on side or two sides adhesive or coated fiberglass. If you want to place a custom order , pls kindly offer a drawing or leave your custom order information .

Q: How much are the pads?

A: Price is depended on your size, thickness, quantity, and other requirements, such as adhesive and others. Please let us know these factors first so that we could give you an exact price.

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5.0W/Mk Good Thermal Conductive Heat Sink Pad For Memory Modules

5.0W/Mk Good Thermal Conductive Heat Sink Pad For Memory Modules

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