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3.0 W/MK 2.0mmT Soft Compressible Thermal Conductive Gap Pad For IT Infrastructure

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3.0 W/MK 2.0mmT Soft Compressible Thermal Conductive Gap Pad For IT Infrastructure

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Brand Name : ZIITEK

Model Number : TIF180-30-11US

Certification : UL and RoHs

Place of Origin : China

MOQ : 1000pcs

Price : negotiation

Supply Ability : 100000pcs/day

Delivery Time : 3-5 work days

Packaging Details : 1000pcs/bag

Heat Capacity : 1 l/g-K

Thermal conductivity : 3.0 W/m-K

Hardness : 20±5 Shore 00

Density : 3.0 g/cc

Continuos Use Temp : -40 to 160℃

Flame rating : 94 V0

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3.0 W/mK ,2.0mmT Soft and compressible thermal conductive gap pad for IT infrastructure

The TIF180-30-11US is a highly compliant Gap Pad material that is ideal for fragile component leads. The material is fiberglass reinforced for improved puncture resistance and handling Ziitek TIF180-30-11US maintains a conformable, yet elastic nature that provides excellent interfacing and wet-out characteristics, even to surfaces with high roughness or uneven topography. Ziitek TIF180-30-11US features an inherent tack on both sides of the material, eliminating the need for thermally impeding adhesive layers.Options and ConfigurationsStandard sheet size - 8" x 16" or custom configurationStandard thickness available - 0.020", 0.040", 0.060", 0.080", 0.100", 0.125", 0.160", 0.200", 0.250"Custom made configurations available upon request

TIF100-30-11US-Series-Datasheet-.pdf


Features

> Good thermal conductive: 3.0 W/mK

>Thickness:2.0mmT

>hardness:20±5 shore00

>Colour: gray

>Fiberglass reinforced for puncture, shear and tear resistance

>Easy release construction


Applications

>IT infrastructure

>GPS navigation and other portable devices

>CD-Rom, DVD-Rom cooling

>notebook

>power supply

>Heat pipe thermal solutions

Typical Properties of TIF180-30-11US Series
Color
gray
Visual
Composite Thickness
Thermal Impedance@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone rubber
***
10mils / 0.254 mm
0.16
20mils / 0.508 mm
0.20

Specific gravity

3.0g/cc
ASTM D297
30mils / 0.762 mm
0.31
40mils / 1.016 mm
0.36
Thickness
2.0mmT
***
50mils / 1.270 mm
0.42
60mils / 1.524 mm
0.48
Hardness
20±5 Shore 00
ASTM 2240
70mils / 1.778 mm
0.53
80mils / 2.032 mm
0.63
Outgassing(TML)
0.35%
ASTM E595
90mils / 2.286 mm
0.73
100mils / 2.540 mm
0.81
Continuos Use Temp
-40 to 160℃
***
110mils / 2.794 mm
0.86
120mils / 3.048 mm
0.93
Dielectric Breakdown Voltage
>5500 VAC
ASTM D149
130mils / 3.302mm
1.00
140mils /3.556 mm
1.08
Dielectric Constant
4.0 MHz
ASTM D150
150mils / 3.810 mm
1.13
160mils / 4.064 mm
1.20
Volume Resistivity
1.0X1012
Ohm-cm
ASTM D257
170mils / 4.318 mm
1.24
180mils / 4.572 mm
1.32
Fire rating
94 V0
equivalent
UL
190mils / 4.826 mm
1.41
200mils / 5.080 mm
1.52
Thermal conductivity
3.0 W/m-K
ASTM D5470
Visua l/ ASTM D751
ASTM D5470

Company Profile

Ziitek company is a manufacturer of thermal conductive gap fillers, low melting point thermal interface materials, thermal conductive insulators, thermally conductive tapes, electrically & thermally conductive Interface pads and thermal grease,Thermal Conductive plastic,Silicone Rubber,Silicone Foams,Phase Changing Materials products, with well-equipped testing equipment and strong technical force.

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

UL

Standard Thicknesses:

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

Consult the factory to alternate thickness.

3.0 W/MK 2.0mmT Soft Compressible Thermal Conductive Gap Pad For IT Infrastructure

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Product Tags:

Soft Thermal Conductive Gap Pad

      

Compressible Thermal Conductive Gap Pad

      

Compressible thermal conductivity pad

      
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