1.0mmT professional factory thermal gap filler For telecommunication hardware 3.0 W/mK ultra soft,20 Shore 00
The TIF540-30-11US Series is a highly compliant Gap Pad material that is ideal for fragile component leads. The material is fiberglass reinforced for improved puncture resistance and handling TIF540-30-11US maintains a conformable, yet elastic nature that provides excellent interfacing and wet-out characteristics, even to surfaces with high roughness or uneven topography. TIF540-30-11US features an inherent tack on both sides of the material, eliminating the need for thermally impeding adhesive layers.Options and ConfigurationsStandard sheet size - 8" x 16" or custom configurationStandard thickness available - 0.020", 0.040", 0.060", 0.080", 0.100", 0.125", 0.160", 0.200", 0.250"Custom made configurations available upon request
TIF500-30-11US Datasheet-REV02.pdf
Features:
> Good thermal conductive: 3.0 W/mK
>Thickness:1.0mmT
>Naturally tacky needing no further adhesive coating
>Broad range of hardnesses available
>UL recognized
>RoHS compliant
Applications:
>Telecommunication hardware
>Handheld portable electronics
>Memory Modules
>Mass storage devices
>GPS navigation and other portable devices
>CD-Rom, DVD-Rom cooling
| Typical Properties of TIF540-30-11US Series |
| Color | Gray | Visual | Composite Thickness | hermalImpedance
@10psi
(℃-in²/W) |
| Construction &
Compostion | Ceramic filled silicone rubber | *** | 10mils / 0.254 mm | 0.55 |
| 20mils / 0.508 mm | 0.82 |
| Specific Gravity | 2.9 g/cc | ASTM D297 | 30mils / 0.762 mm | 1.01 |
| 40mils / 1.016 mm | 1.11 |
| Thickness | 1.0mmT | *** | 50mils / 1.270 mm | 1.27 |
| 60mils / 1.524 mm | 1.45 |
| Hardness | 20 (Shore 00) | ASTM 2240 | 70mils / 1.778 mm | 1.61 |
| 80mils / 2.032 mm | 1.77 |
| Tensile Strength | 40 psi | ASTM D412 | 90mils / 2.286 mm | 1.91 |
| 100mils / 2.540 mm | 2.05 |
| Continuos Use Temp | -40 to 160℃ | *** | 110mils / 2.794 mm | 2.16 |
| 120mils / 3.048 mm | 2.29 |
| Dielectric Breakdown Voltage | >5500 VAC | ASTM D149 | 130mils / 3.302mm | 2.44 |
| 140mils / 3.556 mm | 2.56 |
| Dielectric Constant | 4.0 MHz | ASTM D150 | 150mils / 3.810 mm | 2.67 |
| 160mils / 4.064 mm | 2.77 |
| Volume Resistivity | 1.0X1012
Ohm-meter | ASTM D257 | 170mils / 4.318 mm | 2.89 |
| 180mils / 4.572 mm | 2.98 |
| Fire rating | 94 V0 | equivalent UL | 190mils / 4.826 mm | 3.05 |
| 200mils / 5.080 mm | 3.14 |
| Thermal conductivity | 3.0W/m-K | ASTM D5470 | Visua l/ ASTM D751 | ASTM D5470 |
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Why Choose us ?
1.Our value message is'' Do it right the First time, total quality control''.
2.Our core competencies is thermal conductive interface materials
3.Competitive advantage products.
4.Condidentiality agreement Bussiness Secrect Contract
5.Free sample offer
6.Quality assurance contract
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Product Tags:
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Ultra Soft 1.0mmT Thermal Gap Filler For Telecommunication 3.0 W/MK 20 Shore 00 Images
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