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Thermal Conductive Gap Pad For Semiconductor ATE 20±5 Shore 00 3.0 W/M-K

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Thermal Conductive Gap Pad For Semiconductor ATE 20±5 Shore 00 3.0 W/M-K

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Brand Name : ZIITEK

Model Number : TIF1120-30-11US

Certification : UL and RoHs

Place of Origin : China

MOQ : 1000pcs

Price : negotiation

Supply Ability : 100000pcs/day

Delivery Time : 3-5 work days

Packaging Details : 1000pcs/bag

Heat Capacity : 1 l/g-K

Thermal conductivity : 3.0 W/m-K

Hardness : 20±5 Shore 00

Density : 3.0 g/cc

Continuos Use Temp : -40 to 160℃

Flame rating : 94 V0

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Thermal conductive gap pad for semiconductor automated test equipment (ATE),20±5 Shore 00,3.0 W/m-K

The TIF1120-30-11US is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Ziitek ***(导热片型号) is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high-voltage, bare-leaded devices.

TIF100-30-11US-Series-Datasheet-.pdf


Features

> Good thermal conductive: 3.0 W/mK

>Thickness:3.0mmT

>hardness:20±5 shore00

>Colour: gray

>UL recognized

>Fiberglass reinforced for puncture, shear and tear resistance

>Easy release construction


Applications

>Semiconductor automated test equipment (ATE)

>CPU

>display card

>Automotive electronics

>Set top boxes

>Audio and video components

Typical Properties of TIF1120-30-11US Series
Color
gray
Visual
Composite Thickness
Thermal Impedance@10psi
(℃-in²/W)
Construction &
Compostion
Ceramic filled silicone rubber
***
10mils / 0.254 mm
0.16
20mils / 0.508 mm
0.20

Specific gravity
3.0g/cc
ASTM D297
30mils / 0.762 mm
0.31
40mils / 1.016 mm
0.36
Thickness
3.0mmT
***
50mils / 1.270 mm
0.42
60mils / 1.524 mm
0.48
Hardness
20±5 Shore 00
ASTM 2240
70mils / 1.778 mm
0.53
80mils / 2.032 mm
0.63
Outgassing(TML)
0.35%
ASTM E595
90mils / 2.286 mm
0.73
100mils / 2.540 mm
0.81
Continuos Use Temp
-40 to 160℃
***
110mils / 2.794 mm
0.86
120mils / 3.048 mm
0.93
Dielectric Breakdown Voltage
>5500 VAC
ASTM D149
130mils / 3.302mm
1.00
140mils /3.556 mm
1.08
Dielectric Constant
4.0 MHz
ASTM D150
150mils / 3.810 mm
1.13
160mils / 4.064 mm
1.20
Volume Resistivity
1.0X1012
Ohm-cm
ASTM D257
170mils / 4.318 mm
1.24
180mils / 4.572 mm
1.32
Fire rating
94 V0
equivalent
UL
190mils / 4.826 mm
1.41
200mils / 5.080 mm
1.52
Thermal conductivity
3.0 W/m-K
ASTM D5470
Visua l/ ASTM D751
ASTM D5470

Company Profile

Ziitek Electronic Material and Technology Ltd. is a R&D and production company, we have many production lines and processing technology of thermal conductive materials, owns advanced production equipment and optimized process, can provide various thermal solutions for different applications.

Packaging Details & Lead time

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

Thermal Conductive Gap Pad For Semiconductor ATE 20±5 Shore 00 3.0 W/M-K

FAQ

Q: Do you provide samples ? is it free or extra cost?

A: Yes, we could offer samples free of charge

Q: What is your terms of payment ?

A: Payment<=2000USD, T/T in advance. Paying in time and faithful for several months, we can apply other payment term for you, pay together in every month or 30 days.


Product Tags:

ATE Thermal Conductive Gap Pad

      

94 V0 gap pad thermal conductivity

      

RoHs Thermal Conductive Gap Pad

      
Wholesale Thermal Conductive Gap Pad For Semiconductor ATE 20±5 Shore 00 3.0 W/M-K from china suppliers

Thermal Conductive Gap Pad For Semiconductor ATE 20±5 Shore 00 3.0 W/M-K Images

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