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Soft Compressible 1.5mmt Thermally Conductive Gap Filler For Low Stress Applications

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Soft Compressible 1.5mmt Thermally Conductive Gap Filler For Low Stress Applications

Name: Soft Compressible 15mmt Thermally Conductive Gap Filler For Low Stress Applications
Brand: ZIITEK
Price: 1 USD

Wholesale Soft Compressible 1.5mmt Thermally Conductive Gap Filler For Low Stress Applications from china suppliers

Brand Name : ZIITEK

Model Number : TIF160-40-11US

Certification : UL and RoHs

Place of Origin : China

MOQ : 1000pcs

Price : negotiation

Supply Ability : 100000pcs/day

Delivery Time : 3-5 work days

Packaging Details : 1000pcs/bag

Certifications : UL and RoHs

Colour : gray

hardness : 20 shore 00

Thermal conductivity : 4.0 W/m-K

keyword : thermal gap pad

name : Soft Compressible 1.5mmt Thermally Conductive Gap Filler For Low Stress Applications

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Soft and compressible for low stress applications 1.5mmT silicone sheets for Mass storage devices

The TIF160-40-11US is a silicone based, thermally conductive gap pad. Its unreinforced construction allows additional compliancy. This product has low hardness is conformable and is electrically isolating. The low modulus characteristic of the product offers optimal thermal performance with the ease of handling

TIF100-40-11US-Series-Datasheet.pdf

Features

> Good thermal conductive: 4.0 W/mK

>Thickness:1.5mmT

>hardness:20 shore 00

>Colour: Gray

>RoHS compliant

>UL recognized

>Easy release construction

Applications

>Automotive electronics

>Set top boxes

>Audio and video components

>IT infrastructure

>GPS navigation and other portable devices

>CD-Rom, DVD-Rom cooling

Typical Properties of TIF160-40-11US Series
Color	gray	Visual	Composite Thickness	Thermal Impedance@10psi (℃-in²/W)
Construction & Compostion	Ceramic filled silicone elastomer	***	10mils / 0.254 mm	0.16
			20mils / 0.508 mm	0.20
Denisty	3.15g/cm³	ASTM D297	30mils / 0.762 mm	0.31
			40mils / 1.016 mm	0.36
Thickness	1.5mmT	***	50mils / 1.270 mm	0.42
			60mils / 1.524 mm	0.48
Hardness	20 Shore 00	ASTM 2240	70mils / 1.778 mm	0.53
			80mils / 2.032 mm	0.63
Outgasing (TML)	0.40%	ASTM E595	90mils / 2.286 mm	0.73
			100mils / 2.540 mm	0.81
Continuos Use Temp	-40 to 160℃	***	110mils / 2.794 mm	0.86
			120mils / 3.048 mm	0.93
Dielectric Breakdown Voltage	>5500 VAC	ASTM D149	130mils / 3.302mm	1.00
			140mils /3.556 mm	1.08
Dielectric Constant	4.0 MHz	ASTM D150	150mils / 3.810 mm	1.13
			160mils / 4.064 mm	1.20
Volume Resistivity	6.0X10¹² Ohm-cm	ASTM D257	170mils / 4.318 mm	1.24
			180mils / 4.572 mm	1.32
Fire rating	94 V0	equivalent UL	190mils / 4.826 mm	1.41
			200mils / 5.080 mm	1.52
Thermal conductivity	4.0 W/m-K	ASTM D5470	Visua l/ ASTM D751	ASTM D5470

Company Profile

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

Standard Sheets Sizes:

8" x 16"(203mm x 406mm)

TIF™ series Individual die cut shapes can be supplied.

Soft Compressible 1.5mmt Thermally Conductive Gap Filler For Low Stress Applications

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Q: What is your terms of payment ?

A: Payment<=2000USD, T/T in advance. Paying in time and faithful for several months, we can apply other payment term for you, pay together in every month or 30 days.

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Soft Compressible 1.5mmt Thermally Conductive Gap Filler For Low Stress Applications

Soft Compressible 1.5mmt Thermally Conductive Gap Filler For Low Stress Applications

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Soft Compressible 1.5mmt Thermally Conductive Gap Filler For Low Stress Applications Images