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CPU Density Conductive Thermal Pad with 1.5mmT Thickness and Ceramic Filled Silicone Elastomer Construction

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CPU Density Conductive Thermal Pad with 1.5mmT Thickness and Ceramic Filled Silicone Elastomer Construction

Name: CPU Density Conductive Thermal Pad with 15mmT Thickness and Ceramic Filled Silicone Elastomer Construction
Brand: ZIITEK
Price: 1 USD

Wholesale CPU Density Conductive Thermal Pad with 1.5mmT Thickness and Ceramic Filled Silicone Elastomer Construction from china suppliers

Brand Name : ZIITEK

Model Number : TIF760QE

Certification : UL and RoHs

Place of Origin : China

MOQ : 1000pcs

Price : negotiation

Supply Ability : 10000/day

Delivery Time : 3-5work days

Packaging Details : 1000pcs/bag

Products name : High-Density conductive thermal pad For CPU

Thermal conductivity& Compostion : 8.0 W/m-K

Thickness : 1.5mmT

Specific Gravity : 3.5g/cc

Continuos Use Temp : -45℃ to 200℃

Hardness : 35±10 Shore 00

Construction : Ceramic filled silicone elastomer

Keywords : Thermal Pad

Color : Gray

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High-Density conductive thermal pad For CPU

The TIF760QE is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Ziitek TIF760QE is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high-voltage, bare-leaded devices.

Features:

> Good thermal conductive:8.0 W/mK

> Naturally tacky needing no further adhesive coating
> Soft and Compressible for low stress applications
> Available in varies thickness

> Outstanding thermal performance
> High tack surface reduces contact resistance
> RoHS compliant
> UL recognized

Applications:

> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Mainboard/mother board

Typical Properties of TIF760QE Series
Color	Gray	Visual
Construction & Compostion	Ceramic filled silicone elastomer	******
Specific Gravity	3.5g/cc	ASTM D297
thickness	1.5mm	ASTM D374
Hardness	35±10 (Shore 00)	ASTM 2240
Continuos Use Temp	-45 to 200℃	******
Dielectric Breakdown Voltage	>5500 VAC	ASTM D149
Dielectric Constant	5.5MHz	ASTM D150
Volume Resistivity	1.0X10¹²Ohm-meter	ASTM D257
Fire rating	94 V0	equivalent UL
Thermal conductivity	8.0W/m-K	ASTM D5470

Standard Thicknesses:

0.020" (0.51mm) 0.030" (0.76mm)

0.040" (1.02mm) 0.050" (1.27mm) 0.060" (1.52mm)

0.070" (1.78mm) 0.080" (2.03mm) 0.090" (2.29mm)

0.100" (2.54mm) 0.110" (2.79mm) 0.120" (3.05mm)

0.130" (3.30mm) 0.140" (3.56mm) 0.150" (3.81mm)

0.160" (4.06mm) 0.170" (4.32mm) 0.180" (4.57mm)

0.190" (4.83mm) 0.200" (5.08mm)

Consult the factory to alternate thickness.

Standard Sheets Sizes:
8" x 16"(203mm x 406mm)
TIF™ series Individual die cut shapes can be supplied.

CPU Density Conductive Thermal Pad with 1.5mmT Thickness and Ceramic Filled Silicone Elastomer Construction

Company Profile

Ziitek Electronic Material and Technology Ltd. is dedicated to developing composite thermal solution and manufacturing superior thermal interface materials for competitive market. Our vast experience allows us to assist our customers best in thermal engineering field.We serve customers with customized products, full product lines and flexible production, which makes us be the best and reliable partner of you. Let's make your design more perfect!

Certifications:

ISO9001:2015

ISO14001: 2004 IATF16949:2016

IECQ QC 080000:2017

Why Choose us ?

1.Our value message is'' Do it right the First time, total quality control''.

2.Our core competencies is thermal conductive interface materials

3.Competitive advantage products.

4.Condidentiality agreement Bussiness Secrect Contract

5.Free sample offer

6.Quality assurance contract.

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CPU Density Conductive Thermal Pad with 1.5mmT Thickness and Ceramic Filled Silicone Elastomer Construction

CPU Density Conductive Thermal Pad with 1.5mmT Thickness and Ceramic Filled Silicone Elastomer Construction

CPU Density Thermal Pad

Ceramic Filled Silicone Elastomer Thermal Pad

1.5mmT Thickness Thermal Pad

CPU Density Conductive Thermal Pad with 1.5mmT Thickness and Ceramic Filled Silicone Elastomer Construction Images